Material testing
Sensors
Measurement / control
Special products
Standards
Wazau inside
Material testing -- Systems -- Solderability
Solderability Test Equipment Type LPL
 
Type LPL
The equipment is used to test the solderability of metals in accordance with DIN 32 506, DIN 40 046 and DIN IEC 68.
It has an elevating mechanism which enables the test pieces to be dipped and withdrawn at speeds from 0 to 40 mm/sec. The equipment is provided with two solder baths: T05 and T06. These are plugged into the measuring and control equipment. While the test is being carried out using the baths, the other can be prepared for the next test. A potentiometer is used to regulate the dipping speed and immersion time in a solder bath can be regulated by a potentiometer, as can the temperature, within a range of 0 to 450°C.
PDF Info back Solder-Ball Test Equipment