Material testing -- Systems -- Solderability
			Solder Ball Test Equipment Type LKU   The test equipment is used to determine the solderability of wires, components and soldered connections, using the solder ball method. The equipment consists of a heating device and a pick-up device which lowers the test specimen into a tin bead at a defined speed. Time is measured automatically. The desired temperature of the solder ball of 250°C + 5°C is maintained by an electronic control circuit.