Solderability testing device type LPK

• The device tests the solderability of metals under DIN 32506.

The device has a lifting unit which allows a defined submerging and emerging of specimen with submerging speeds from 0 to 45 mm/s. The lifting unit has a maximal lifting height of 25 mm. The device is works with a quartz controlled submerging duration of 0 to 10 s. The still dipping solder bath can be a T 05 or a T 06 which is connected by plugging it into the rack of the measurement and controlling mechanism.

The submerging speed and submerging duration in the solder bath are adjusted via a potentiometer and displayed on an LCD display. The temperature in the solder bath can be adjusted from room temperature to 450 °C via a PID temperature control. The power supply for the controller is provided by an IEC-320 AC power cordset 230 VAC (50/60 Hz).