Solderability testing device type LPL
- The device tests the solderability of metals under DIN 32506.
The device has a lifting unit which allows a defined submerging and emerging of specimen with submerging speeds from 0 to 45 mm/s. The lifting unit has a maximal lifting height of 25 mm. The device is works with a quartz controlled submerging duration of 0 to 10 s. The basic device consists of the lifting unit and the controlling device. The still dipping solder bath can be a T 05 or a T 06 which is connected by plugging it into the rack of the measurement and controlling mechanism. The lifting unit can be displaced between the two solder baths. The submerging speed and submerging duration in the solder bath are adjusted via a potentiometer and displayed on an LCD display. The temperature in the solder bath can be adjusted from room temperature to 450°C via a PID temperature control. The power supply for the controller is provided by an IEC-320 AC power cordset 230 VAC (50/60 Hz).
|Geometry of specimen:||Electronic components / connections|
|Power input:||230 VAC 500 / 1000 VA|
|Dimensions (testing device):||500 x 300 x 300 mm (W x D x H)|
|Weight (testing device):||ca. 10 kg|